Promex Industries Inc. (Promex) is increasing its manufacturing operations by including superior programs that help the medical machine trade’s most demanding microelectronics functions. The newly put in LPKF CuttingMaster 2127 ultraviolet (UV) laser de-panelling and Koh Younger aSPIre 3 automated solder paste inspection (SPI) programs will enhance flexibility and throughput in Promex’s meeting course of choices. The brand new programs permit for continued high-level integration, from the chip/wafer degree to completed boards, on varied substrate supplies.
“These investments reinforce our dedication to serving to medtech OEM prospects construct extra superior, compact, and dependable digital assemblies,” stated Dave Fromm, Chief Operations Officer at Promex. “Collectively, the brand new laser and SPI programs broaden our core capabilities and permit us to ship greater high quality, yield, and consistency—from prototype to manufacturing—reflecting our dedication to not simply assembly however staying forward of trade and buyer wants.”
UV laser de-panelling
Laser de-panelling supplies exact UV laser singulation, micromachining, and reducing for varied natural and composite supplies generally present in medical microelectronics units, particularly these using heterogeneous integration to co-package digital and non-electronic parts.
Supplies processed embrace polyimide and liquid crystal polymer (LCP) versatile circuit boards, FR4 circuit boards, natural/laminate substrates and interposers, and overmoulded plastics/composites. With a <20 µm spot measurement and ±25 µm positional accuracy, the laser permits engineers to design boards with advanced kind elements and tighter layouts. Moreover, the precision reduces as much as 30% of lifeless house between parts on the panel.
Guaranteeing clear, stress-free singulation of flex and rigid-flex circuits is necessary when assembly buyer demand for chip-on-flex and versatile packaging for medical units. By offering this in-house, the corporate can enhance turnaround occasions, course of controls, and high quality.
“This laser reducing expertise is crucial for OEMs with micro medical units,” stated Fromm. “It supplies the cleanest reduce by means of quite a lot of supplies – together with titanium, steels, glass, and sapphire – which is crucial for machine performance and reliability.”
Inline SPI metrology
Promex has additionally added inline SPI metrology capabilities to satisfy fine-pitch floor mount expertise (SMT) calls for. The system inspects solder paste deposits in all areas and each panel, capturing statistical knowledge and constructing paste libraries for every machine design.
This data-driven method ensures excessive requirements within the True 3D SPI market, bettering yield, offering predictive high quality management, and making certain tighter course of home windows which can be important within the meeting of superior parts like ball grid arrays (BGAs), chiplets, and high-density interconnects. These capabilities are crucial in superior medical machine meeting on skinny, versatile circuit boards, the place solder printing will not be constant throughout the print space.
“There’s additionally the connection to flex itself – medical units (usually implantables) are pushing the bounds for ultra-thin flex with small (all the way down to 008004) half sizes at excessive half placement densities,” stated Fromm. “Automated SPI is critical to create a strong course of to assemble these units and to make sure ongoing high quality.”