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Monday, September 8, 2025

Boson+ IQ Growth Package – DRONELIFE


New equipment combines {hardware} and software program to speed up AI integration for protection, safety, and industrial purposes

Teledyne FLIR OEM has launched the BosonĀ®+ IQ Growth Package, a brand new answer designed to hurry up the combination of thermal imaging and synthetic intelligence (AI) on the edge. The announcement was made forward of DSEI UK 2025, one of many world’s main protection and safety exhibitions, set to happen in London from September 9 to 12.

A Complete Growth Platform

The Boson+ IQ Growth Package brings collectively reference {hardware} and Prismā„¢ software program, giving system integrators a platform to create superior edge AI capabilities. At its core is the Teledyne FLIR OEM AVP, powered by the QualcommĀ® Dragonwingā„¢ QCS8550 system-on-chip (SoC). The SoC delivers 50 trillion operations per second (TOPS) whereas drawing solely 2.5 watts of energy.

Its multicore structure helps Prism AI object detection fashions and Prism ISP (Picture Sign Processing) options, together with denoising and tremendous decision. These capabilities guarantee clear imaging in tough environments, which is vital for protection, safety, and industrial use.

ā€œThe Boson+ IQ Dev Package represents a significant leap ahead for integrators constructing smarter, extra environment friendly thermal programs on the edge with AI significantly for autonomy purposes reminiscent of aerial drones, loitering munitions, and ground-based robotics,ā€ stated Jared Faraudo, vp of product administration and applications, Teledyne FLIR OEM. ā€œBy combining our high-performance Boson+ thermal digicam with Prism AI and ISP software program on a cutting-edge Qualcomm compute platform, we’re enabling quicker growth cycles, industry-best picture high quality, and longer mission endurance with minimal energy consumption.ā€

Versatile and Scalable Design

The event equipment was designed with scalability in thoughts. It contains interface and service boards with three MIPI interfaces, permitting builders to combine seen or different sensor sorts alongside thermal cameras. To streamline growth, the package deal additionally contains the Boson+ and Prism SDKs, {hardware} interface management documentation, and entry to engineering assist.

This design helps integrators transfer extra effectively from prototype to full deployment. The equipment’s flexibility is anticipated to enchantment to builders working throughout a number of sectors, from protection to industrial automation.

Future-Prepared Capabilities

The Boson+ IQ Growth Package is appropriate with upcoming software program options reminiscent of Prism SKR and Prism Supervisor. Prism SKR will allow autonomous goal detection and terminal steerage. Prism Supervisor will present autonomous navigation to waypoints utilizing GPS or visual-based navigation (VBN) expertise.

These additions are anticipated to develop the equipment’s potential for mission-critical purposes, providing enhanced situational consciousness and autonomy in advanced environments.

Attendees at DSEI UK 2025 can see the Boson+ IQ Growth Package on the Teledyne FLIR stand (#S3-110) at ExCeL London. The exhibition runs September 9–12 and is acknowledged as one of many world’s premier protection and safety occasions.

For extra data, go to Teledyne FLIR OEM.

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